| 品名 | 叙述 | 詢價 |
|---|---|---|
| 氢氟酸 (HF) | 3nm-130nm | |
| Hydrochloric Acid (HCl) | 3nm-130nm | |
| Ammonium Fluoride (NH4F) | 用于二氧化矽 (SiO2) 和矽酸盐材料的蚀刻过程。 | |
| 醋酸 (CH3COOH) | 用于光刻和清洁过程中,去除有机残留物并改善光刻胶的附着力。 | |
| Hydrogen Peroxide (H2O2) | 3nm-130nm | |
| Nitric Acid (HNO3) | 3nm-130nm | |
| Phosphoric Acid (H3PO4) | 3nm-130nm | |
| Sulfuric Acid (H2SO4) | 3nm-130nm | |
| Ammonium Hydroxide (NH4OH) | 3nm-130nm | |
| Potassium Hydroxide solution (KOH) | 3nm-130nm | |
| Sodium Hydroxide solution (NaOH) | 3nm-130nm | |
| Tetramethylammonium Hydroxide solution (TMAH) | 3nm-130nm |