品名 | 叙述 | 詢價 |
---|---|---|
氢氟酸 (HF) | 3nm-130nm | |
Hydrochloric Acid (HCl) | 3nm-130nm | |
Ammonium Fluoride (NH4F) | 用于二氧化矽 (SiO2) 和矽酸盐材料的蚀刻过程。 | |
醋酸 (CH3COOH) | 用于光刻和清洁过程中,去除有机残留物并改善光刻胶的附着力。 | |
Hydrogen Peroxide (H2O2) | 3nm-130nm | |
Nitric Acid (HNO3) | 3nm-130nm | |
Phosphoric Acid (H3PO4) | 3nm-130nm | |
Sulfuric Acid (H2SO4) | 3nm-130nm | |
Ammonium Hydroxide (NH4OH) | 3nm-130nm | |
Potassium Hydroxide solution (KOH) | 3nm-130nm | |
Sodium Hydroxide solution (NaOH) | 3nm-130nm | |
Tetramethylammonium Hydroxide solution (TMAH) | 3nm-130nm |